
GaN
buffer layer
Background
Owing to the
lack of feasible bulk growth methods, GaN is
commonly deposited epitaxially on foreign
substrates like SiC and sapphire (Al2O3).
Both substrate materials are badly matched to
GaN with respect to their lattice constant
and the thermal expansion coefficients. In
addition, the epitaxially deposited atoms are
very mobile on the plain substrate, resulting
in difficulties in homogeneously wetting the
substrate. This problem is circumvented by
depositing an AlN or GaN layer at a
comparatively low temperature before the
growth of the main layer at a higher
temperature is initiated. The lower
temperature significantly reduces the adatom
mobility, leading to three-dimensional growth
and complete coverage of the substrate with
crystallites. The main layer growth involves
a transition to two-dimensional layer-by-layer
growth of GaN. Consequently the structural
quality of the main layer, noteworthy the
density of threading dislocations, is
intimately related with the buffer layer
properties.
LT-GaN Buffer Layers
We have
performed many studies on the impact of the
details of the buffer layer on the quality of
the resulting GaN main layer using our MBE
machine. Our studies concentrated mainly on c-plane
sapphire substrates, although we also
considered other orientations of Al2O3
as well as Ge, SiC, and Si as substrate
materials. The actual sequence of growth
steps is sapphire nitridation, leading in
part to a conversion of Al2O3
into AlN, low-temperature (LT) GaN
deposition, and GaN main layer deposition.

Our main
interest was the stoichiometry of the LT
buffer layer, and the explanation of the main
layer properties in terms of the strain
during the growth. The main finding was that
variations of the stoichiometry towards an
increased Ga content reduced the strain
during the main layer growth and resulted in
improved structural quality (less
dislocations) and higher carrier mobility.
Ga-Metal Buffer Layers
As a
natural limit of the stochiometry of LT-GaN
buffer layers we studied plain Ga metal films
deposited as wetting layers onto the sapphire
substrates (LBNL patent
IB-1461). The layer is
converted into GaN by exposure to the
Nitrogen from the plasma source during the
heating to the main-layer growth temperature.
Superior quality GaN main layers were
achieved for a specific thickness of the
deposited Ga metal layer. Using X-ray
photoelectron spectroscopy we were able to
detect Ga-N as well as Ga-Ga bonds in these
buffer layers. We assume that metallic
inclusions mediate a strong strain relief
mechanism in these buffer layers.
Experimental evidence for the strain relief
action was provided by ex-situ biaxial
straining of the samples using a pressure
cell. Herein, the main layer strain was
monitored as a function of the amount of
bending of the sample. The strain transport
from the sapphire to the GaN main layer is
found to be strongly reduced for the Ga metal
buffer layer as compared with a rigid
stoichiometric LT-GaN buffer layer.
Consequently the superior main layer quality
is explained by the resulting reduction of
strain during the main layer growth.

Related
Publications
Elastic
strain relief in nitridated Ga metal buffer
layers for epitaxial GaN growth
Y. Kim, N.A. Shapiro, H. Feick, R. Armitage,
E.R. Weber
Appl. Phys. Lett. 78, 895 (2001).
ONLINE
GaN
thin films by growth on Ga-rich GaN buffer
layers
Y. Kim, Sudhir G. S., H. Siegle, J. Krüger,
P. Perlin, E.R. Weber, S. Ruvimov and Z.
Liliental-Weber
J. Appl. Phys. 88, 6032 (2000).
ONLINE
Improved
Heteroepitaxial MBE GaN Growth with a Ga
Metal Buffer Layer
Y. Kim, Sudhir G.S., J. Krüger, H Siegle, N.A.
Shapiro, R. Armitage, H. Feick, E.R. Weber, C.
Kisielowski, Y. Yang
Mat. Res. Soc. Symp. Vol. 622, T4.10 (2000).
ONLINE
Effect
of N/Ga flux ratio in GaN buffer layer growth
by MBE on (0001) sapphire on defect formation
in the GaN main layer
S. Ruvimov, Z. Lilienthal-Weber, J. Washburn,
Y. Kim, Sudhir G.S., J. Krüger, E.R. Weber
Mat. Res. Soc. Symp. Vol. 572, 295 (1999).
Chemical
and structural transformation of sapphrie (Al2O3)
surface by plasma source nitridation
Y.Cho, Y. Kim, E.R. Weber, S. Ruvimov, Z.
Liliental-Weber
J. Appl. Phys. 85, 7909 (1999).
ONLINE
Chemical
and structural analysis of nitridated
sapphire
Y. Cho, S. Rouvimov, Y. Kim, Z. Lilienthal-Weber,
E.R. Weber
Mat. Res. Soc. Symp. Vol. 482, 45 (1998).
Stress
controlled MBE-growth of GaN:Mg and GaN:Si
Y. Kim, R. Klockenbrink, C. Kisielowski, J.
Krüger, D. Corlatan, Sudhir G.S., Y. Peyrot,
Y. Cho, M. Rubin, and E.R. Weber
Mat. Res. Soc. Symp. Vol. 482, 217 (1998).
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Comparative
analysis of strain and stress in MBE and
MOCVD grown GaN thin films on sapphire
J. Krüger, Sudhir G.S., D. Corlatan, Y. Cho,
Y. Kim, R. Klockenbrink, S. Ruvimov, Z.
Lilienthal-Weber, C. Kisielowski, M. Rubin, E.R.
Weber, B. McDermott, R. Pittman, E. R.
Gertner
Mat. Res. Soc. Symp. Vol. 482, 447 (1998).
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Impact
of growth temperature, pressure and strain on
the morphology of GaN films
H. Fujii, C. Kisielowski, J. Krüger, M.S.H.
Leung, R. Klockenbrink, M. Rubin, E.R. Weber
Mat. Res. Soc. Symp. Vol. 449, 227 (1997).
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Intrinsic
and thermal stress in gallium nitride
epitaxial films
J.W. Ager, T. Suski, S. Ruvimov, J. Krüger,
G. Conti, E.R. Weber, M.D. Bremser, R. Davis,
C.P. Kuo
Mat. Res. Soc. Symp. Vol. , 775(1997).
Strain-related
phenomena in GaN thin films
C. Kisielowski, J. Krüger, S. Ruvimov, T.
Suski, J.W. Ager III, E. Jones, Z. Liliental-Weber,
M. Rubin, E.R.Weber, M.D. Bremser, R.F. Davis
Phys. Rev. B 54, 17745 (1996).
ONLINE
Effect
of Si doping on the dislocation structure of
GaN grown on the A-face of sapphire
S. Ruvimov, Z. Liliental-Weber, T. Suski, J.
W. Ager III, J. Washburn, J. Krüger, C.
Kisielowski, E. R. Weber, H. Amano and I.
Akasaki
Appl. Phys. Lett. 69, 990 (1996).
ONLINE
Strain
effects in GaN thin film growth
J. Krüger, C. Kisielowski, T. Suski, S.
Ruvimov, Z. Liliental-Weber, J.W. Ager III, M.
Rubin, and E.R. Weber
Proc. IEEE SIMC-9, Conf. on Semi-Insulating
and Semiconducting Materials, Toulouse, 1996,
p. 89.
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ONLINE
Origin
of strain in GaN thin films
C. Kisielowski, J. Krüger, M. Leung, R.
Klockenbrinck, H. Fujii, T. Suski, Sudhir G.S.,
J. W. Ager III, M. Rubin, and E.R. Weber
Proc. 23rd Internat. Conf. Phys. Semicond.
Vol. 4, World Scientific, Singapore, p. 513 (1996).