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The Morris Group
Solder Contacts and Reliability Discussion
July 20th-21st, 2008

July 20th:  Dinner at Sequoyah Country Club
July 21st:  All-day Meeting on UC Berkeley Campus (521 Cory Hall)
Topics of Discussion:
  • Manufacturing – wetting, defects, inspection
  • Reliability: thermal issues – intermetallic growth, Sn whiskers
  • Reliability: mechanical issues – impact, creep, thermal fatigue
  • Reliability: electromechanical issues – electromigration
  • Materials and configurations – can we invent our way out of these problems?
Itinerary To Be Announced.
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