SERDAR AKSU: RESUME: LAST UPDATE ON 9/19/2001
Serdar Aksu
E-mail: serdar@socrates.berkeley.edu
Web Site: www.mse.berkeley.edu/groups/doyle/serdar/serdar.html
Address: 1622 MLK Jr. Way Apt: A, Berkeley, CA 94709
Office : (510) 642 5317
Home : (510) 665 4799
Mobile : (510) 333 5008
Fax : (510) 643 5792
EDUCATION
Ph.D., Candidate, Materials Science and Engineering, University of California at Berkeley , GPA:
3.78
Thesis topic: “The Role of Complexing Agents in the Chemical
Mechanical Planarization (CMP) of Copper Thin Films”, expected Dec
2001
Advisor: Fiona M. Doyle
Primary specialization: Materials Science and Engineering
Minors: Electronic Materials; Civil and Environmental Engineering
M.S., Metallurgical and Materials
Engineering , Colorado School of Mines,
Golden, CO , May 1996, GPA: 3.98
Thesis title: “The Role of Lattice Heterogeneity and Roughness in the
Establishment of Critical Surface Tension of Wetting of Naturally-Hydrophobic
Solid Substrates”
B.Sc., Mining Engineering, Middle East Technical University , Ankara, Turkey, June 1992
FIELDS OF INTEREST
PROFESSIONAL EXPERIENCE
In Materials Science and Engineering
Department at University of California
at Berkeley
In Metallurgical and Materials
Engineering Department at Colorado School of
Mines
Others
ACADEMIC HONORS
SKILLS
Experimental:
Characterization:
Computer:
Language:
OTHER PROFESSIONAL ACTIVITIES
·
Aksu S. and Doyle F. M., Electrochemistry of Copper in
Aqueous Ethylenediamine Solutions Submitted to The Journal of Electrochemical
Society
PDF FILES: Text
Figures
Tables
·
Aksu S. and Doyle F. M., Electrochemistry of Copper in Chemical
Mechanical Planarization (CMP) Slurries Containing Glycine Submitted to The
Journal of Electrochemical Society
PDF FILES: Text
Figures
Tables
·
Aksu S. and Doyle F. M., Electrochemistry of Copper in
Aqueous Glycine Solutions The Journal of Electrochemical Society, Vol. 148,
No.1, pp. B51-B57, 2001.
PDF FILES: Text
Figures
Tables
·
Aksu S. and Doyle F. M., The Role of EDTA and Glycine
in the Chemical
Mechanical Planarization (CMP) of Copper In Proc. 2nd International
Conference on Processing Materials for Properties Editors: B. Mishra and C.
Yamauchi, pp. 217-222, San Francisco, November 5-8, 2000
PDF FILE: Entire
Article
·
Aksu S. and Doyle F. M., Potential-pH Diagrams for
Copper in Aqueous Solutions of Various Organic Complexing Agents In Proc. 197th
Meeting of Electrochemical Society; Electrochemistry and Metal Processing
Editors: R. Woods and F. M. Doyle, pp. 258-269, Toronto, Canada May 14-18, 2000
PDF FILE: Entire
Article
·
Yarar B. and Aksu S., Quantification of the Roles of
Surface Heterogeneity and Roughness in the Establishment of the Critical
Surface Tension of Wetting of Hydrophobic Solids
In Proc. XX International Mineral Processing Congress
Editors: Heinz Hoberg and Harro von Blottnitz ,Vol. 3, pp. 41-51, Aachen,
Germany, 1997
·
Yekeler M., Aksu S. and Yarar B., Model for the
Prediction of the Critical Surface Tension of Wetting of Low Surface Energy
Minerals In Proc. 1st UBC-MCGill Bi-Annual International Symposium
on Fundamentals of Mineral Processing Editors: J.S. Laskowski and G.W. Poling,
pp. 17-27, Vancouver, British Colombia, 1995
PUBLICATIONS IN PREPARATION: Aksu S. and Doyle F. M.
POSTER PRESENTATIONS: Aksu S. and Doyle F. M.
· The Utilization of Organic Complexing Agents in the Chemical Mechanical Polishing (CMP) of copper
In Symposium on Strategic Issues in Chemical Polishing Processes, Berkeley, CA, 1998
· The Role of Glycine in the Chemical Mechanical Polishing (CMP) of Copper
In Symposium on R & D Needs in the Electronic Industry, Berkeley, CA, 2000
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You can reach me at: serdar@socrates.berkeley.edu |