SERDAR AKSU : RESEARCH

---

CURRENT RESEARCH PROJECT

"The Role of Complexing Agents in the Chemical Mechanical Planarization (CMP) of Copper Thin Films"

In the Materials Science and Engineering Department, University of California, Berkeley

Advisor: Prof. Fiona M. Doyle.

The Role of Complexing Agents in the Chemical Mechanical Planarization (CMP) of Copper Thin Films

CMP will be an essential process in the production of integrated circuits containing copper interconnects.  In this project, the role of complexing agents in reactive slurries representative of those that might be used in copper CMP is studied, with the aim of improving our understanding of the mechanisms at play.  The processes involved in the oxidative dissolution of copper are investigated by various electrochemical techniques.  To delineate the specific effect of complexing agents on the dissolution and polishing of copper, electrochemical tests are conducted in aqueous media with and without complexing agents. The tests thus far indicated that complexing agents curtail the formation of copper oxide films during polishing, and hence may improve the CMP process by controlling the oxide thickness.

MY DOCUMENTS ON THE RESEARCH PROJECT
PROJECT DESCRIPTION AND THE PROPOSAL Brief description of the project Abstract for the project proposal Project proposal (PDF FILE)	LITERATURE REVIEWS ON COPPER INTERCONNECTION Review in 1998 (PDF FILE) Review in 1999 (PDF FILE)

Interested? Would like to hear more? If so, here is the link to

MY PUBLICATIONS

and here is another link to one of my recent presentations:

ROLE OF GLYCINE IN THE COPPER CMP

WEB RESOURCES ON COPPER INTERCONNECTION AND CMP

ON-LINE JOURNALS

• Semiconductor International
• Solid State Technology
• IBM Journals
• IBM R&D Journal

ARTICLES

· Copper CMP: A Question of Tradeoffs

· Copper Metrology Gains Complexity, Capabilities

· Copper, Low-k Metrology Scale the Learning Curve

· Dual-Damascene: Overcoming Process Issues

· Evaluating and Treating CMP Wastewater

· Photostrip Faces 300 mm, Copper and Low-k Convergence

· A Process for Efficient Treatment of Cu CMP Wastewater

· Tantalum, Copper and Damascene: The Future of Interconnects

· The future of interconnection technology

· Damascene copper electroplating for chip interconnections

INSTITUTIONS

· SEMATECH

· Semiseek

WEB RESOURCES ON ELECTROCHEMISTRY

ON-LINE JOURNALS

• Journal of Electrochemical Society
• Electrochemical and Solid-State Letters

INSTITUTIONS

• The Electrochemical Society

OTHERS

· Electrochemistry Refresher

· Fundamentals of Copper Electroplating

WEB RESOURCES ON CORROSION

ON-LINE HELP

• Corrosion Source
• Corrosion Doctors
• The Science of Localized Corrosion (a collaborative research project)
• Protective Coatings, Linings and Related Resources (searchable databases)
• The Materials Corrosion & Environmental Effects Laboratory, Los Alamos National Laboratory

INSTITUTIONS

• The Electrochemical Society, Corrosion Division
• NACE International—The Corrosion Society
• Fontana Corrosion Center, Ohio State University
• The Brockhouse Institute for Materials Research, McMaster University
• Institute of Materials Chemistry and Corrosion
• Institute für Metallurgie, Technische Universitat Clausthal

ON-LINE JOURNALS

• The Journal of Corrosion Science and Engineering (JCSE)

COPPER ELECTROPLATING

q Fundamentals of Copper Electroplating

q Acid Through-Hole Plating

q IBM R&D: Damascene copper electroplating for chip interconnections

q Rodel EP Copper Products

q IBM R&D: ELECTROCHEMICAL FABRICATION

Research	Resume	School	Industry
People	Media	About Me	Information
Sports	Photos	Music	Others
Google	Yahoo	Craigslist	SiteEdit

BACK TO THE MAIN PAGE

You can reach me at: serdar@socrates.berkeley.edu