J.W. Morris, Jr



Professor
Dept. of Materials Science and Mineral Engineering
555 Evans Hall MS #1760
University of California
Berkeley CA 94720
510-642-3815
jwmorris@lbl.gov
Materials Sciences Division
Lawrence Berkeley National Laboratory
One Cyclotron Road, MS 66
Berkeley, CA 94720
510-486-4832
jwmorris@lbl.gov


Morris course information can be found at bottom of this page


BIOGRAPHY

J. W. Morris, Jr., is Professor of Metallurgy, Materials Science and Mineral Engineering, at the University of California at Berkeley and is also Program Leader, Structural Materials, at the Center for Advanced Materials , Materials Science Division, Lawrence Berkeley National Laboratory. He received a B.S. in Metallurgical Engineering (1964) and an ScD in Materials Science (1969) both from MIT. He was employed at the Bell Aerospace Company, Buffalo, New York, from 1968-1971 and joined the faculty of Materials Science at the University of California, Berkeley and the staff of the Lawrence Berkeley Laboratory in 1971.


CURRENT RESEARCH

Research in Professor Morris' group concerns the design and behavior analysis of metals and alloys that have useful mechanical or electromagnetic properties. Current research projects include the following:

ULTRA-HARD MATERIALS

In collaboration with Prof. Daryl Chrzan (MSME) and Profs. Marvin Cohen and Stephen Louie (Physics), we are studying the sources of hardness in ultrahard materials. The research is theoretical, and involves first-principles calculation and simulation of deformation processes in ultrahard materials. The specific materials of interest include transition metal carbides and nitrides and the diamond-like materials.


ULTRA-HIGH STRENGTH MATERIALS

The perennial search for structural steels with optimal strength/toughness combinations requires that we understand how to preserve ductile fracture and optimize fracture toughness at high strength levels. Our present research is concentrated on the toughness of ultra-high strength Fe-Ni-Mo-Co alloys, which is controlled by a combination of the martensitic microstructure and the residual inclusion content.

MARTENSITIC TRANSFORMATION

The computer model...


FORMABILITY

The formability of a metal is controlled by two factors: its inherent plasticity, and the friction developed at its interface with the tool piece. Plasticity is, in turn, controlled by the work hardening of the material. Our current research addresses the work hardening of aluminum alloys and its relation to the deformation patterns developed during tensile elongation. Interfacial friction is strongly influenced by the topology of the metal surface. Our current research addresses methods of characterizing surface topology, and the manipulation of surface topology to control forming friction as measured in "draw-bead simulation" tests.


NON-DESTRUCTIVE TESTING

In collaboration with Prof. John Clarke (Physics) and Dr. Kannan Krishnan (National Center for Electron Microscopy) we are studying the applications of high-resolution SQUID microscopy to the non-destructive testing of ferritic steels. Mechanical deformation or subtle microstructural changes in ferritic steels produce changes in local magnetic fields that can be detected by a new high-resolution SQUID microscope invented at Berkeley. The potential of the SQUID microscope is studied through tests on specimens with known thermomechanical history, coupled with high-resolution TEM studies of the magnetic microstructure.

ELECTROMIGRATION IN THIN-FILM CONDUCTORS

The active elements of microelectronic circuits communicate through narrow, thin-film metallic conductors that transport very high current densities. The high current densities drive mass diffusion which can lead to voiding and failure. We are investigating the rates and microstructural mechanisms of failure in narrow lines through electromigration testing of lines with controlled microstructure and high-resolution TEM analyses of failure sites.

RELIABLE MICROELECTRONIC PACKAGING

A microelectronic device consists of active microelectronic elements joined together in a package. The elements of the package that are often most critical to reliability are the electrical interconnections, particularly the solder contacts. These provide the mechanical structure as well as the electrical pathways. Our research addresses the microstructures and microstructural mechanisms of deformation and failure in solder contacts that are subject to thermal fatigue. The important metallurgical mechanisms include high temperature creep, creep fatigue and microstructural instability.

 

SELECTED RECENT PUBLICATIONS (2001-2002)

complete publication list (click here)


THE MORRIS GROUP

Currently comprised of 2 research scientists and 8 graduate student research assistants, Professor Morris' group has graduated more than 70 PhD's, most of whom are engaged in industrial research on structural or electronic materials.


COURSE INFORMATION

MAT SCI 201A: Thermodynamics and Phase Transformations in Solids

WF 2-4 pm, 458 Evans Hall.

Professor Morris Fall 02 Office Hours:
Monday:
W/F:
555 Evans Hall
(510) 642-3815

E45: The Structure and Properties of Materials

Professor Morris Spring 02 Office Hours:


555 Evans Hall
(510) 642-3815



Last updated 05/7/02
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