Home ] Up ]


Wide bandgap semiconductor research - MBE growth of GaN

 
Home

Research
  - Wide bandgap
   
GaN MBE
    -
PLD of GaN
    -
GaN buffer layer
    -
InGaN LEDs
    -
HEMT Reliability
    
- ZnO

   - Projects


Facilities
Publications
Group members
Address list
Group Seminar
Useful links and phone numbers
 
 



Atomic Force Microscopy images showing different GaN grain size depending on the growth temperature
 


MBE Growth of GaN

General

GaN molecular beam epitaxy (MBE) growth is a non-equilibrium process where a Ga vapor beam from an effusion cell and an activated nitrogen beam from a plasma source are directed toward a heated substrate. Under suitable conditions, layer-by-layer deposition of Ga and N atomic planes is possible. The MBE procedure is performed in an ultra-high vacuum chamber, minimizing film contamination. Other advantages of MBE are its capability to create heterostructures with sharp interfaces, and to form metastable phases such as zincblende-structure GaN. 

The Riber MBE growth camber

In addition to Ga, our MBE chamber is equipped with Si and Mg cells for n- and p-type doping, as well as In for surfactant studies and InGaN growth. We also have available a Bi cell for surfactant studies, and plan to install an Al source for AlGaN growth in the near future.

 

The Nitrogen Plasma Source

Glow discharge nitrogen plasma source in actionThe activated nitrogen beam is supplied by a custom DC plasma source designed and built by the team of Dr. Andre Anders here at LBNL. In this source, excited neutral nitrogen molecules are formed in an electric field-free region and accelerated toward the substrate by the pressure gradient with the vacuum chamber. Because the activated nitrogen is not accelerated by electric fields, it arrives at the substrate with low kinetic energy on the order of 1 eV. This approach allows reaction to form GaN, but prevents film damage associated with high kinetic energy species such as those produced by RF plasma sources. Our GaN layers exhibit low levels of defect luminescence compared to layers grown with other types of plasma sources.

 


Schematic of the DC discharge plasma source

 

Surfactant Growth

The major drawback to the MBE technique for GaN growth is that it must be carried out at relatively low temperatures (~700-800 C for MBE vs. 1000-1100 C for CVD techniques). As GaN is thermodynamically unstable under vacuum, the film actually can undergo decomposition into Ga and nitrogen gas during MBE growth. At high temperatures the decomposition rate becomes faster than the deposition rate, setting an upper limit on MBE substrate temperature. Low substrate temperature reduces surface atom mobility, leading to increased defect densities in the GaN epilayer. One way to get around this problem is to increase the surface adatom mobility by means of a surfactant impurity. Atoms such as As, In, and Mg have exhibited surfactant effects for GaN MBE growth. Below are some results in our chamber using the Bi impurity as a surfactant (LBNL patent IB-1290). GaN layers grown with optimized Bi surfactant flux exhibit much larger grain sizes as observed by AFM, and somewhat improved asymmetric x-ray rocking curves.


This page was made by Henning Feick 

Please e-mail Mike or Joerg updates

Last revised: 12/18/01

 

[Home]

[Research]

[People]

[Publications]

[Seminar ]